The skill of slicing

We manufacture silicon wafers for solar panels. We can slice both mono-crystal and multi-crystal with 2 kind of way such as fixed abrasive (Diamond-wire) and loose abrasive (Normal-wire).
We possess 12 machines for fixed-abrasive, 13 machines for loose abrasive, total 25 machines, furthermore, we have a plan to increase machines for fixed abrasive for customer's demands.
Recently, the skill of Diamond-wire has been known around the world.
In the near future, the skill will be more needed for manufacturing silicon wafers. Therefore, we have gotten ready to provide our skill to our customers and solar industry since last November.
Currently, our yield rate is over 95% with Diamond-Wire and we have successfully achieved manufacturing mass production with Diamond-Wire.
2,400K pieces wafers are supplied per month. In the near future, the demand is going to be increased rapidly.
We will struggle to develop the quality and increase more quantity.

Auto inspecting machine Wire Saw for Diamond-Wire
■Auto inspecting machine
■Wire Saw for Diamond-Wire

The skill of Slicing: The Slicing processing of the material

We mainly perform Slicing the silicon for solar panels. It is made from mono crystal and multiple crystals. The attractiveness of using multi wiring is to enable us to cut thinly without any damage on the products. Currently, we have been trying to cut big products as thin and as cheap as possible. In addition, we started Diamond Wire Slicing processing. Therefore, we successfully achieved lower cost and high speed Slicing technology of about three times more than isolation processing. Now, we are building additional new factory to expand Diamond processing. It will be completed in April 2010.

Wire-saw Wire-saw
■Wire-saw

■ Outside diameter: until 8inc